DDR BGA Stencil Kit is suitable for memory chips, graphics card chips, and 12 kinds of memory ball-planting steel meshes commonly used in notebooks can be directly heated by an 862D hot air gun, and the size of the solder balls used is 0.45MM. Graphics card memory, BGA package memory, notebook video memory 12 product specifications: DDR1, DDR2, DDR2-2, DDR2-3 DDR2-4, DDR3, DDR3-2 DDR3-3, DDR3-4KF, DDR3-5, DDR3-6, DDR5.

This set of stencils can be applied to commonly used second and third-generation BGA packaged memory, desktop graphics card memory, integrated video memory on notebook motherboards, and video memory on notebook graphics cards, as well as some BGA, packaged network cards, and power chips with regular spacing.