AMTECH-NC-559-ASM flux paste is a lead-free, halogen-free, no-clean BGA flux paste with a very light residue color and a very high SIR value. It is used in a low-ionic activator system. It has fast tin wetting speed, low smoke generation, and high surface insulation resistance after the residue is cured. Therefore, the electrical interference to mobile phones and other communication products is very small. The flux paste is a moderately active rosin-type flux paste, widely used in the repair flux paste of SMDs such as mobile phone PCB, BGA, and PGA.

Product parameters:

Product name: BGA flux paste

Product weight: 100g

Color: transparent white paste

Product highlights:

• ROL0 flux classification

• Exceptional print definition at high printing speeds up to 100mm/sec

• Long stencil life

• Wide process window

• Clear residue

• Low voiding

• Excellent wetting compatibility on most board finishes

• Compatible with enclosed print heads

• Compatible with high-temperature alloys (221-300 °C)

• Print & Dispense grade solder paste available