Heat-conducting silicone grease with a coefficient of 5W/mk can help chips, power modules, heat sinks, etc., to cool down quickly and achieve effective heat dissipation. The thermal compound fills the gap between the ASIC chip and the heat sink so that the heat dissipated can be transferred more quickly. It has the characteristics of cold resistance, high-temperature resistance, good insulation performance, fast cooling speed, and wide working temperature. To ensure the performance of the thermal grease, it is recommended to reapply it after half a year of use to prevent chip performance degradation and failure to dissipate heat caused by the drying of the thermal grease.

Product features:

No fear of temperature difference, cold and heat resistance: not affected by bad weather, can withstand cold and high temperatures;

Rapid cooling, good insulation: strong thermal conductivity, good insulation, aging resistance, quickly reduces the temperature of ASIC chips, CPU, and other heating components;

Wide range of use and strong applicability; suitable for LED, CPU, chip, power supply, heat sink, etc.